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Resource typeConference Paper
Title(s)Experimental Investigation of Efficiency and Deposit Process Temperature during Multi-Layer Friction Surfacing
CreatorKallien, Zina  0009-0003-5133-0624 (Helmholtz-Zentrum Hereon  03qjp1d79)
Roos, Arne (Helmholtz-Zentrum Hereon  03qjp1d79)
Klusemann, Benjamin  0000-0002-8516-5087  142865192 (Institut für Produktionstechnik und -systeme (IPTS), Leuphana Universität Lüneburg  02w2y2t16)
AbstractMulti-layer friction surfacing (MLFS) follows the principle of the friction surfacing (FS) process, which is an established solid state coating technology for similar and dissimilar metallic materials. With this approach, the deposition of a consumable material on a substrate is enabled via friction and severe plastic deformation (SPD), processing the material below its melting temperature. The focus of the present study lies on the investigation of the temperature distribution during MLFS deposition. The measurements show that the temperature within the stack tends to be slightly higher on the advancing side. Additionally, the deposition behavior, i.e. deposition rate and consumable stud consumption rate, was investigated. Along MLFS stack height, deposition efficiency tends to sightly decrease, shown by decreasing layer thickness and increased length of remaining consumable studs. Overall, MLFS is highly repeatable for multiple layers and presents stable deposition conditions. Additionally, the technique has a comparatively low heat input to the substrate and the already deposited material.
KeywordsAdditive Manufacturing; Dissimilar Aluminum Alloys; Multi-Layer Friction Surfacing; Solid State Layer Deposition; Temperature
Year of publication in PubData2024
Publishing typeParallel publication
Publication versionPublished version
Date issued2022-07-22
Creation contextResearch
Published byMedien- und Informationszentrum, Leuphana Universität Lüneburg
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Resource typeConference Proceeding
Title of the resource typeKey Engineering Materials
IdentifierDOI: 10.4028/p-s43q63
Publication year2022
Pages187 - 193
PublisherTrans Tech Publications Ltd
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